Semiconductor Laboratory  | |
| 
 | 
DecapsulationDecapsulation is the process of opening a packaged integrated circuit to see what is inside. Often the plastic encapsulation of integrate circuits is removed with strong acids. There is a commercial product called Dynasolve which is used for this purpose. There is a rosin method IC-Entkapselung_mit_Kolophonium that does not use such harsh acids. Another possibiity is to use an oxygen plasma. This is, however, a slow method. An interesting website for decapsulation is https://www.richis-lab.de (in German). Below are some links to devices described on that website. 
 Below is a description of some decapsulation projects. 
  |