513.160 Microelectronics and Micromechanics

Outline

• Introduction Chapter 1: Introduction
• The evolution of microelectronics
• Moore's law
• Why the future doesn't need us
• Semiconductors and semiconductor devices Chapter 4: Silicon
• Examples of crystal structures
• silicon
• simple cubic, fcc, bcc, hcp, diamond, zincblende, wurzite
• Miller indices     W
• Intrinsic semiconductors
• Extrinsic semiconductors
• pn-junctions
• Abrupt junction plots
• PN diode IV characteristics
• PN diode current-temperature characteristics at constant voltage
• PN diode voltage-temperature characteristics at constant current
• metal-semiconductor contacts
• Band diagram of a n-Schottky diode
• Band diagram of a p-Schottky diode
• Lithography Chapter 8: Pattern generation, Chapter 9: Optical lithography
• Pattern generation
• Electron beam lithography
• Optical lithography and EUV
• Photoresist
• Spin coating
• Spray coating
• Nanoimprint lithography
• Crystal and thin film growth Chapter 5: Thin film material and processes, Chapter 6: Epitaxy
• Purification of silicon
• Czochralski process
• Float Zone process
• Molecular beam epitaxy
• RHEED
• Chemical vapor deposition
• Semiconducting heterostructures
• Atomic layer deposition
• Laser ablation
• Thermal evaporation
• Sputtering
• Etching Chapter 11: Etching, Chapter 20: Anisotropic wet etching, Chapter 21: Deep Reactive Ion Etching, Chapter 16: Chemical–Mechanical Polishing
• Wet chemical etching
• KOH
• HF
• Ion milling
• Reactive ion etching
• Bosch process
• Chemical-Mechanical Polishing
• Damascene process
• Cleaning Chapter 12: Cleaning
• Clean rooms, FOUPs
• Particle removal
• Organics removal
• Metals removal
• Oxide removal
• Doping Chapter 14: Diffusion, Chapter 15: Ion implantation
• Neutron transmutation
• Diffusion
• Limited source diffusion
• Constant source diffusion
• Predeposition and drive-in
• Ion implantation
• Oxidation Chapter 13: Thermal oxidation
• Dry oxidation
• Wet oxidation
• Deal-Groves Model
• CMOS Chapter 26: MOS fabrication, Chapter 28: Multilevel metallization
• MOSFETs
• Front end
• Wells
• Shallow trench isolation
• Self-aligned gates
• Contacts
• Back end
  • Metalization
  • Passivation
  • Packaging
• Memories
• DRAM
• SRAM
• Flash
• Phase change memory
• Micromechanics Chapter 29: Surface micromachining, Chapter 30: MEMs process integration
• Vibrations of beams and cantilevers
• Cantilevers
• Fixed beams
• Sacrificial layers
• Stiction
• Supercritical drying
• Accelerometers
• Gyroscopes
• Microphones
• Capacitive comb drives
• Rotary motors
• RF MEMs
• Micromirror displays
• Hinges, pop-up structures
• Wafer level optics
• Microfluidics
• Nozzles
• Bubble pumps
• Piezoelectric activated pumps
• Surface acoustic wave pumps
• Lab-on-a-chip
• Bottom-up technologies
• The end of miniaturization
• Self assembly
• Bio inspired materials