Institute of Solid State Physics

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Filler Material Insertion for Electron Beam Welding of Thick Copper Components
C. Voglreiter
Institute of Materials Science and Welding, Graz University of Technology, Graz, Austria
15:00 - 17:00 Monday 28 September 2015 Foyer Alte Technik

Due to its high thermal and electric conductivity, copper (Cu) is used in industrial applications like cooling and in electric components. However, conventional welding of thick walled copper components can be difficult, due to the fast dissipation of the welding energy. Electron beam welding (EBW) provides a high enough input energy density to weld thick components in one pass. In a previous work, electron beam welding in flat welding position (PA) of pure copper has been investigated. It was shown, that it is difficult to obtain a sound weld due to the low viscosity and surface tension of pure copper which leads to severe welding defects during solidification. With selecting CuSn6 as a filler material in form of a sheet, local alloying changed the material properties significantly and a defect-free weld was produced.
In respect to industrial applications, alternative filler material insertion techniques were investigated and trial welds were performed. First, a manual application by brushing a tin-paste onto the welding surfaces is investigated. Furthermore, an application of tin by the means of plasma spraying is conducted. The parts coated with these two tin coating techniques were welded by electron beam welding. It can be shown, that the applied tin supports the welding process by building a tin-bronze weld pool with a higher viscosity than pure copper, thus stabilizing the solidification mechanism.